Carrier film with peripheral slits

Details Carrier film with peripheral slits Carrier film with peripheral slits

1995-09-25

1998-05-26

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257673, 257676, 257698, 257687, H01L 2348, H05K 720

Patent

active

057570680

ABSTRACT:
There is provided a carrier film (130, 140) having a plurality of slits (135) formed by the periphery of a chip mounting region (138) on which a semiconductor chip 10 is to be mounted. The chip mounting region is rectangular and four slits are formed along the four sides of the chip mounting region. The slits may be formed by means of punching with a die or etching.

REFERENCES:
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5161009 (1992-11-01), Tandi et al.
patent: 5220486 (1993-06-01), Takubo et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5586666 (1996-12-01), Imamura
European Search Report, dated Apr. 24, 1997.

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