Ceramic terminal block, hermetic sealed package, and complex sem

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Details

257705, 257706, 257675, 257674, H01L 23495, H01L 2310, H01L 2315

Patent

active

059071850

ABSTRACT:
This invention provides a package for complex semiconductor devices and a ceramic terminal block useful for the package. For example, the package might contain a semiconductor laser diode and a Peltier device for cooling the laser diode. A ceramic terminal block has metallized electrode patterns formed thereon which extend inside and outside the package. Grooves are formed in some of the metallized electrode patterns for the leads of the Peltier device. Inward extending leads are fixed on the grooves of the electrode patterns for the Peltier leads. The leads of the Peltier device are soldered to the inward leads.

REFERENCES:
patent: 4672417 (1987-06-01), Sugiyama et al.

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