Sub-ambient temperature electronic package
Superconducting apparatus having dew-preventable Peltier-effect
Supporting member for cooling means and electronic package using
Surface mount and flip chip technology with diamond film passiva
Surface mount package with high thermal conductivity
Surface mount semiconductor package
Surface-mount semiconductor package
System and apparatus for venting electronic packages and...
System and device including a barrier layer
System and method for dissipating heat from a semiconductor...
System and method for forming a grid array device package employ
System and method using self-assembled nano structures in...
System and method using self-assembled nano structures in...
System for clamping heat sink
System for controlling the temperature of an associated...
System for dissipating heat and shielding electromagnetic...
System for uniformly interconnecting and cooling
System having stackable heat sink structures