System for controlling the temperature of an associated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257SE23088, C257S713000, C257S704000, C257S706000, C257S707000, C257SE23097, C257S721000

Reexamination Certificate

active

07656028

ABSTRACT:
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.

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International Search Report and Written Opinion corresponding to PCT/US2006/006126 under date of mailing of Feb. 9, 2007.

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