System and method using self-assembled nano structures in...

Details System and method using self-assembled nano structures in... System and method using self-assembled nano structures in...

2006-09-19

2006-09-19

Sarkar, Asok Kumar (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23101, C257SE23105, C438S122000, C977S742000, C977S762000

Reexamination Certificate

active

07109581

ABSTRACT:
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.

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