Surface-mount semiconductor package

Details Surface-mount semiconductor package Surface-mount semiconductor package

1996-01-04

1998-06-09

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257666, 257676, 257713, 257692, H01L 3902

Patent

active

057639493

ABSTRACT:
A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastic material body. Electrical control connections to the semiconductor package include first and second pads which are spaced apart from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads. The pads may be partially sheared, to step them, thereby allowing a single thickness lead frame to be used in the manufacture of the device. On the lower face of the body there are channels which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.

REFERENCES:
patent: 5430331 (1995-07-01), Hamzehdoost et al.

Affiliated with

Also associated with

Rating

Surface-mount semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface-mount semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface-mount semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2203700