Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-04-12
1998-06-30
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257722, 257796, 361703, 361717, 165803, H01L 2334, H01L 2328
Patent
active
057738866
ABSTRACT:
Electronic systems utilizing a plurality of integrated circuit packages having a stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the buttonlike projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottom-most fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.
REFERENCES:
patent: 2414801 (1947-01-01), Clarke
patent: 3205936 (1965-09-01), Katz
patent: 3372733 (1968-03-01), Callender
patent: 3388739 (1968-06-01), Olson et al.
patent: 3413532 (1968-11-01), Boyer
patent: 3457988 (1969-07-01), Meyerhoff et al.
patent: 4340902 (1982-07-01), Honda et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4404582 (1983-09-01), Pollard et al.
patent: 4535384 (1985-08-01), Wakabayashi et al.
patent: 4620215 (1986-10-01), Lee
patent: 4785075 (1988-11-01), Shimp
patent: 4839422 (1989-06-01), Craig, Jr.
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5172301 (1992-12-01), Schneider
patent: 5175612 (1992-12-01), Long et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5292930 (1994-03-01), Pitasi
patent: 5654587 (1997-08-01), Schneider et al.
patent: 5693981 (1997-12-01), Schneider et al.
St. Marys Carbon Company document entitled "Powder Metallurgy Division".
Sue Oliver. LSI Logic Corporation; My Hguyen and Michael Grosse, Johnson Matthey Electronics, "Siler/Poolymer Die Attach for Ceramic Package Assembly,".
Joroski Joseph H.
Rostoker Michael D.
Schneider Mark R.
LSI Logic Corporation
Ostrowski David
Thomas Tom
LandOfFree
System having stackable heat sink structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System having stackable heat sink structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System having stackable heat sink structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1862963