Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-02
2011-10-18
Sarkar, Asok (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S778000, C438S108000, C438S125000, C977S742000, C977S763000
Reexamination Certificate
active
08039953
ABSTRACT:
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
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Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
Sarkar Asok
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