System for clamping heat sink

Details System for clamping heat sink System for clamping heat sink

2006-12-01

2011-11-08

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23101

Reexamination Certificate

active

08053888

ABSTRACT:
A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment. Accordingly, the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink. To prevent excessive clamping force from damaging the semiconductor device, loading columns may extend between the cover and the heat sink.

REFERENCES:
patent: 2008/0285239 (2008-11-01), Yun

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