Die-up ball grid array package with patterned stiffener opening
Die-up ball grid array package with printed circuit board...
Die-up ball grid array package with printed circuit board...
Die-up integrated circuit package with grounded stiffener
Die-warpage compensation structures for thinned-die devices,...
Dielectric layer structure
Direct attach chip scale package
Dual chip with heat sink
Dummy wafers and methods for making the same
Efficiency CPU cooling arrangement
EL device sealing plate, multiple sealing plate-producing...
Elastomer interposer with voids in a compressive loading system
Electrical circuit apparatus and methods for assembling same
Electrical or electronic component encapsulated in a sealed...
Electrically shielded glass lid for a packaged device
Electrode for electroplating planar structures
Electronic apparatus with compliant metal chip-substrate bonding
Electronic apparatus with improved thermal expansion match
Electronic assembly comprising solderable thermal interface
Electronic assembly having a wetting layer on a thermally...