Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
1999-01-27
2001-07-24
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S707000, C257S685000, C257S686000, C257S676000
Reexamination Certificate
active
06265771
ABSTRACT:
FIELD OF THE INVENTION
This invention generally relates to apparatus for removing heat from integrated circuits. More particularly it relates to arrangements for removing heat from a stack of integrated circuits.
BACKGROUND OF THE INVENTION
Heat sinks and heat slugs have been used to remove heat from the back of high power integrated circuit chips, as shown in U.S. Pat. Nos. 5,394,298 and 5,297,006. The thermal performance of these systems has not been adequate to accommodate very high power chips, however. The problem has been compounded for semiconductor structures in which chips are stacked. Thus, a better solution is needed that provides for improved heat removal, and this solution is provided by the following invention.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an improved arrangement for removing heat from an integrated circuit chip or a stack of integrated circuit chips.
It is another object of the present invention to provide multiple heat sinks for a semiconductor structure.
It is another object of the present invention to provide a heat sink for a plurality of major surfaces of a semiconductor structure.
It is another object of the present invention to provide a heat sink for each chip of a dual chip stack.
It is a feature of the present invention that a heat sink is provided on the back of each chip of a dual chip stack.
It is an advantage of the present invention that heat is removed from the chips of a dual chip stack in an inexpensive package, such as a plastic package.
These and other objects, features, and advantages of the invention are accomplished by a semiconductor module, comprising a semiconductor structure having a first surface and a second surface. A first heat sink or heat slug thermally contacts the first surface. A second heat sink or heat slug thermally contacts the second surface.
REFERENCES:
patent: 4091408 (1978-05-01), Lee et al.
patent: 4393393 (1983-07-01), Allen, Jr. et al.
patent: 4878106 (1989-10-01), Sachs
patent: 5065281 (1991-11-01), Hernandez et al.
patent: 5199164 (1993-04-01), Kim et al.
patent: 5295044 (1994-03-01), Araki et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5332921 (1994-07-01), Dousen et al.
patent: 5345106 (1994-09-01), Doering et al.
patent: 5377077 (1994-12-01), Burns
patent: 5394298 (1995-02-01), Sagisaka
patent: 5508565 (1996-04-01), Hatakeyame et al.
patent: 5510956 (1996-04-01), Suzuki
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5594282 (1997-01-01), Otsuki
patent: 5615475 (1997-04-01), Burns
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5777381 (1998-07-01), Nishida
patent: 5792677 (1998-08-01), Reddy et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5866943 (1999-02-01), Mertol
patent: 5886408 (1999-03-01), Ohki et al.
patent: 5910682 (1999-06-01), Song
patent: 000484180 (1992-05-01), None
patent: 360137042 (1985-07-01), None
patent: 405129516 (1993-05-01), None
patent: 406021328 (1994-01-01), None
patent: 406097326 (1994-04-01), None
patent: 406132474 (1994-05-01), None
Ference Thomas G.
Howell Wayne J.
Sprogis Edmund J.
Fenty Jesse A.
International Business Machines - Corporation
Leas James M.
Lee Eddie
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