Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-09-08
2008-10-14
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S724000, C257S727000, C361S742000, C361S747000, C361S750000, C361S758000, C361S759000, C438S107000, C438S125000
Reexamination Certificate
active
07436057
ABSTRACT:
An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.
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Brodsky William L.
Long David C.
Miller Jason S.
Torok John G.
Zitz Jeffrey A.
Chambliss Alonzo
DeLio & Peterson LLC
International Business Machines - Corporation
Peterson Peter W.
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