Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-10-10
2006-10-10
Tran, Minh-Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S720000, C257SE23101, C257SE23110
Reexamination Certificate
active
07119434
ABSTRACT:
A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.
REFERENCES:
patent: 2004/0238946 (2004-12-01), Tachibana et al.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, The McGraw -Hill Companies, Inc., Third Edition, pp. 2.36-2.37.
Anon., Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines, Document No. 252161-001, pp. 18 & 25, Nov. 2002.
Anon., Intel 82801 EB I/O Controller Hub 5 (ICH5) and Intel 82801 ER I/O Controller Hub 5 R (ICH5R), Document No. 252673-001, p. 14, Apr. 2003.
C.K. Loh et al, Thermal Characterization of Fan-Heat Sink Systems in Miniature Axial Fan and Micro Blower Airflow, Seventeenth IEE Semi-Therm Symposium, pp. 111-116, Seventeenth Annual IEEE Semi-Therm Symposium, San Jose, CA, Mar. 20-22, 2001.
C.W. Yu et al, Thermal Design of a Desktop System Using CFD Analysis, pp. 18-26, Seventeenth Annual IEEE Semi-Therm Symposium, San Jose, CA, Mar. 20-22, 2001.
B.A. Occhionero et al, Enhanced Thermal Management AlSiC Microprocessor Lids., Ceramic Process Systems, Chartley, MA 02712.
Bhatti Mohinder Singh
Ghosh Debashis
Reyzin Ilya
Delphi Technologies Inc.
Griffin Patrick M.
Tran Minh-Loan
LandOfFree
Efficiency CPU cooling arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Efficiency CPU cooling arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Efficiency CPU cooling arrangement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3704252