Efficiency CPU cooling arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S706000, C257S720000, C257SE23101, C257SE23110

Reexamination Certificate

active

07119434

ABSTRACT:
A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.

REFERENCES:
patent: 2004/0238946 (2004-12-01), Tachibana et al.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, The McGraw -Hill Companies, Inc., Third Edition, pp. 2.36-2.37.
Anon., Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines, Document No. 252161-001, pp. 18 & 25, Nov. 2002.
Anon., Intel 82801 EB I/O Controller Hub 5 (ICH5) and Intel 82801 ER I/O Controller Hub 5 R (ICH5R), Document No. 252673-001, p. 14, Apr. 2003.
C.K. Loh et al, Thermal Characterization of Fan-Heat Sink Systems in Miniature Axial Fan and Micro Blower Airflow, Seventeenth IEE Semi-Therm Symposium, pp. 111-116, Seventeenth Annual IEEE Semi-Therm Symposium, San Jose, CA, Mar. 20-22, 2001.
C.W. Yu et al, Thermal Design of a Desktop System Using CFD Analysis, pp. 18-26, Seventeenth Annual IEEE Semi-Therm Symposium, San Jose, CA, Mar. 20-22, 2001.
B.A. Occhionero et al, Enhanced Thermal Management AlSiC Microprocessor Lids., Ceramic Process Systems, Chartley, MA 02712.

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