Electronic apparatus with improved thermal expansion match

Details Electronic apparatus with improved thermal expansion match Electronic apparatus with improved thermal expansion match

1993-04-14

1994-06-28

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257705, 257707, 257720, H01L 2302, H01L 3902

Patent

active

053249879

ABSTRACT:
Differences in thermal expansion properties between integrated circuit chips, especially of gallium arsenide, and the dielectric substrates (especially diamond and aluminum nitride) on which said chips are mounted are accommodated by interposing between the substrate and the chip a base having diamond pedestals in combination with a material of higher coefficient of thermal expansion than the substrate, typically a metal such as copper or tungsten. The base may be integral with a diamond substrate or may be a shim interposed between the substrate and the chip.

REFERENCES:
patent: 3675089 (1972-07-01), Hantusch et al.
patent: 4256792 (1981-03-01), Koepke et al.
patent: 4460916 (1984-07-01), Hashimoto et al.
patent: 5113315 (1992-05-01), Capp et al.

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