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Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Compliant integrated circuit package and method of fabricating t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Composite ceramic board, method of producing the same,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Composite devices of laminate type and processes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Composite lid for land grid array (LGA) flip-chip package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Composite material including copper and cuprous oxide and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Composite material, and manufacturing method and uses of same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Composite material, and manufacturing method and uses of same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Conducting layer in chip package module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Configurable ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Device and system for heat spreader with controlled thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Device for dissipating heat from a semiconductor element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Device having a heat sink for cooling an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Device packages with low stress assembly process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Device with power semiconductor components for controlling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Diamond-silicon hybrid integrated heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Die clip assembly for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Die-down ball grid array package with die-attached heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Die-up ball grid array package with die-attached heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Die-up ball grid array package with enhanced stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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