Column for module component
Compliant integrated circuit package and method of fabricating t
Composite ceramic board, method of producing the same,...
Composite devices of laminate type and processes
Composite lid for land grid array (LGA) flip-chip package...
Composite material including copper and cuprous oxide and...
Composite material, and manufacturing method and uses of same
Composite material, and manufacturing method and uses of same
Conducting layer in chip package module
Configurable ball grid array package
Device and system for heat spreader with controlled thermal...
Device for dissipating heat from a semiconductor element
Device having a heat sink for cooling an integrated circuit
Device packages with low stress assembly process
Device with power semiconductor components for controlling...
Diamond-silicon hybrid integrated heat spreader
Die clip assembly for semiconductor package
Die-down ball grid array package with die-attached heat...
Die-up ball grid array package with die-attached heat spreader
Die-up ball grid array package with enhanced stiffener