Device for dissipating heat from a semiconductor element

Details Device for dissipating heat from a semiconductor element Device for dissipating heat from a semiconductor element

1998-07-29

2000-02-15

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257721, 257667, 257697, 257722, 257712, 361697, 361702, 361703, H01L 2302, H01L 2348, H05K 720

Patent

active

060256435

ABSTRACT:
A heat sink is constructed in accordance with this invention to increase the spacing surrounding radiating pins which extend outward from a base at the region of highest thermal stress, and to increase the mass of the radiating pins a distance from said region of highest thermal stress to enhance the effects of a thermal differential.

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patent: 5892514 (1998-11-01), Smith et al.

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