Device and system for heat spreader with controlled thermal...

Details Device and system for heat spreader with controlled thermal... Device and system for heat spreader with controlled thermal...

2006-07-25

2006-07-25

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000

Reexamination Certificate

active

07081669

ABSTRACT:
Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

REFERENCES:
patent: 5644163 (1997-07-01), Tsuji
patent: 5728309 (1998-03-01), Matsen et al.
patent: 5829716 (1998-11-01), Kirkwood et al.
patent: 2001/0015492 (2001-08-01), Akram et al.
patent: 2004/0084763 (2004-05-01), Yang

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