Configurable ball grid array package

Details Configurable ball grid array package Configurable ball grid array package

1995-10-04

1998-07-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257787, H01L 2312

Patent

active

057866317

ABSTRACT:
A configurable package for mounting an integrated circuit to a circuit board. The package has a substrate for receiving the integrated circuit. On the substrate are contacts for making electrical connections between the substrate and the integrated circuit. The substrate also has solder balls for making electrical connections between the substrate and the circuit board. Each one of the contacts is in electrical contact with one each of the solder balls. A clip ring/dam ring overlays and attaches to the substrate. The clip ring/dam ring forms a reservoir for receiving the integrated circuit on the substrate. Also, formed at the periphery of the clip ring/dam ring, are clamping tabs. The reservoir can be filled with an encapsulating material, such as epoxy, to complete the package. A lid is provided for covering the integrated circuit. A clip overlays the lid and releasably attaches to the clamping tabs of the insert, and retains the lid to the insert. The lid may have fins formed in it, to act as a heat sink, and dissipate heat by convection to air flowing within the environment.

REFERENCES:
patent: 5386342 (1995-01-01), Rostoker
patent: 5547730 (1996-08-01), Weiblen et al.

Affiliated with

Also associated with

Rating

Configurable ball grid array package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Configurable ball grid array package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Configurable ball grid array package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-25389