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Substrate for semiconductor device and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate for use in wafer attracting apparatus and manufacturin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate having a functionally gradient coefficient of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate having a functionally gradient coefficient of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate including a metal portion and a resin portion

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate structure of BGA semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate-less microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate-less microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrates and assemblies including pre-applied adhesion...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrates and assemblies including pre-applied adhesion...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Super low profile package with high efficiency of heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Supporting a circuit package including a substrate having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Supporting a circuit package including a substrate having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Surface mount ceramic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Surface mount package with improved heat transfer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount package with low coefficient of thermal expansion

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount peripheral leaded and ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount peripheral leaded and ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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