4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material
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Heat sink with thermally compliant beams

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat sinks including nonlinear passageways

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader and stiffener having a stiffener extension

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader as mechanical reinforcement for ultra-thin die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader ball grid array (HSBGA) design for low-k...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader having holes for rivet-like adhesive connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader interconnect for thermally enhanced PBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader package and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader with down set leg attachment feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat transfer structure for a semiconductor device utilizing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat transfer structure for a semiconductor device utilizing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat-dissipating device of a semiconductor device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat-dissipating package for microcircuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Heat-dissipating structure and heat-dissipating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat-radiating device of chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat-releasing printed circuit board and semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heatplates for heatsink attachment for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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