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Method and structure for an organic package with improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method and structure for heatspreader attachment in high...

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Method and structure for manufacturing improved yield...

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Method and structures for enhanced temperature control of...

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Method and system of tape automated bonding

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Method for assembling semiconductor switching elements and...

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Method for bonding heat sinks to overmolds and device formed...

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Method for bonding heat sinks to overmolds and device formed...

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Method for fabricating a lid for a wafer level packaged...

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Method for fabricating an ultralow dielectric constant...

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Method for manufacturing bump leaded film carrier type semicondu

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Method for sealing a semiconductor device and apparatus...

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Method of assembling a ball grid array package with...

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Method of embedding semiconductor chip in support plate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of fabricating an apparatus including a sealed cavity

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Method of increasing package reliability using package lids with

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of making a semiconductor diode from laminated ceramic ta

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Method of manufacturing a dielectric film in a capacitor

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Method of manufacturing a plurality of semiconductor...

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Method of removing free halogen from a halogenated polymer...

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