Method for assembling semiconductor switching elements and...

Details Method for assembling semiconductor switching elements and... Method for assembling semiconductor switching elements and...

2005-12-15

2008-09-09

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C438S121000, C438S122000, C438S124000

Reexamination Certificate

active

07423342

ABSTRACT:
A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a second step which connects the bare chips to a wiring part by wire bonding; and a third step in which a resin which seals the bare chips and the wiring part is applied to the heat sink in a striding manner in a state that output terminal portions of the wiring part and fins of the heat sink are exposed to the outside of the resin.

REFERENCES:
patent: 5719487 (1998-02-01), Sato et al.
patent: 6272015 (2001-08-01), Mangtani
patent: 6977475 (2005-12-01), Kuribayashi et al.
patent: 08-289505 (1996-01-01), None
patent: 09-252563 (1997-09-01), None
patent: 2000-022021 (2000-01-01), None

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