Method and structure for an organic package with improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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C257S779000, C257S781000

Reexamination Certificate

active

07148566

ABSTRACT:
Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.

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