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Silicon interposer-based hybrid voltage regulator system for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Silicon on silicon package with precision align macro

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Single chip modules, repairable multichip modules, and methods o

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Single package containing multiple integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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SiO2 wire bond insulation in semiconductor assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Small memory card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Sockets for module extension and memory system using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stack package of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stack type semiconductor package module utilizing solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked device package for peripheral and center device pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked device underfill and a method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked die packaging and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked dies utilizing cross connection bonding wire

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked double sided integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked integrated circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over-chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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