Stack type semiconductor package module utilizing solder...

Details Stack type semiconductor package module utilizing solder... Stack type semiconductor package module utilizing solder...

2007-11-27

2007-11-27

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S286000, C257S697000

Reexamination Certificate

active

11304047

ABSTRACT:
The stack type semiconductor package module includes a lower semiconductor package having a main substrate, a chip mounted on the main substrate and electrically connected to the main substrate through a wire. An epoxy molding compound (EMC) is provided on the main substrate to cover the chip and the wire. Contact holes are formed in the EMC. A sub-substrate having protrusions coated with solder is connected to the lower semiconductor package by inserting the solder coated protrusions into the contact holes. Heat is applied to the protrusions, and the molten solder solidifies inside the contact holes. An upper semiconductor package having substantially identical structure as the lower package is then stacked on the sub-substrate.

REFERENCES:
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 7132311 (2006-11-01), Akiba et al.

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