Single chip modules, repairable multichip modules, and methods o

Details Single chip modules, repairable multichip modules, and methods o Single chip modules, repairable multichip modules, and methods o

1996-05-20

1998-11-24

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257773, 257787, H01L 2334

Patent

active

058411933

ABSTRACT:
Multichip and single chip modules are presented as well as a chips first fabrication of such modules. The multichip module comprises a plurality of chips affixed in a planar array by a structural material which surrounds the sides of the chips such that the upper surfaces of the chips and an upper surface of the structural material are co-planar and the lower surface of at least one chip and a lower surface of the structural material are co-planar. A photo-patternable dielectric is disposed directly on the upper surfaces of the chips. The photo-patternable dielectric includes vias to at least some contact pads at the upper surfaces of the chips and the module further comprises an intrachip metallization layer on the photo-patternable dielectric layer. Subsequent processing provides a multi-layer chip interconnect structure over the intrachip metallization layer and photo-patternable dielectric. Testing and repair of the module can be accomplished prior to or subsequent to fabrication of the multi-layer chip interconnect. Formation of multiple single chip modules is accomplished by singulating the multichip module into individual packages.

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patent: 5250843 (1993-10-01), Eichelberger
patent: 5315486 (1994-05-01), Fillion et al.
Fillion et al., "CAD/CIM Requirements in Support of Plastic Encapsulated MCM Technology for High Volume, Low Cost Electronics," Advancing Microelectronics, pp. 8-14, Sep./Oct. 1994.

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