Plastic-packaged semiconductor device having a heat sink matched
Plate and column type semiconductor package having heat sink
Polymer encapsulated electrical devices
Polymer encapsulated electrical devices
Potted hybrid integrated circuit
Power control device with semiconductor chips mounted on a...
Pre-bond encapsulation of area array terminated chip and...
Preparation method of underfill for flip chip package and...
Printed circuit board and chip-on-board packages using same
Protective envelope for a semiconductor integrated circuit
RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF...
RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF...
Recessed encapsulated microelectronic devices and methods...
Repairable multi-chip package and high-density memory card...
Resin ceramic compositions having magnetic properties
Resin ceramic compositions having magnetic properties
Resin component for encapsulating semiconductor and...
Resin composition for encapsulating semiconductor chip and...
Resin composition for semiconductor encapsulation,...
Resin encapsulated electrode structure of a semiconductor...