Resin composition for semiconductor encapsulation,...

Details Resin composition for semiconductor encapsulation,... Resin composition for semiconductor encapsulation,...

2006-04-25

2006-04-25

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

Reexamination Certificate

active

07034404

ABSTRACT:
The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25° C. and 5,000 poise or less at 80° C.

REFERENCES:
patent: 5565709 (1996-10-01), Fukushima et al.
patent: 5585421 (1996-12-01), Kawano et al.
patent: 5731370 (1998-03-01), Shiobara et al.
patent: 0 590 975 (1994-04-01), None
patent: 0 829 455 (1998-03-01), None
patent: 1 004 630 (2000-05-01), None
patent: 2-147618 (1990-06-01), None
patent: 2-147618 (1990-06-01), None
patent: 10-125834 (1998-05-01), None
patent: 10168161 (1998-06-01), None
patent: 10-189832 (1998-07-01), None
patent: 10-189832 (1998-07-01), None
patent: 11-17075 (1999-01-01), None
patent: 11-40591 (1999-02-01), None

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