Printed circuit board and chip-on-board packages using same

Details Printed circuit board and chip-on-board packages using same Printed circuit board and chip-on-board packages using same

1998-05-01

2000-08-15

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257678, 257667, 257773, A01L 2328, A01L 2302, A01L 23495, A01L 2348, A01L 2352

Patent

active

061040959

ABSTRACT:
A printed circuit board (PCB) for use in chip-on-board (COB) packages reduces failures due to warping of the COB packages. The PCB includes a board body having a upper surface and a lower surface, a chip bonding area on the upper surface for attaching a semiconductor device, and a plurality of conductors in a circuit pattern on the upper surface outside the chip bonding area, for electrical connection to the semiconductor device using a plurality of bonding wires. An encapsulation region encloses the chip bonding area, the bonding wires, a portion of the plurality of conductors, and a portion of the upper surface. The board includes external contacts on the lower surface for electrical connections to an external electrical appliance, and via holes through the board body for electrically connecting the plurality of conductors in the circuit pattern to the external contacts. A plurality of volume-adjusting regions, on the upper surface outside the chip bonding area and inside the encapsulation region, adjust a volume of a molding compound in the final package.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5175612 (1992-12-01), Long et al.
patent: 5847458 (1998-12-01), Nakamura et al.

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