Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent
1996-11-18
1999-03-02
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
257706, 257707, 257676, H01L 2328, H01L 2310, H01L 2334
Patent
active
058775617
ABSTRACT:
An improved plate and column type semiconductor package has a heat sink embedded in a plate, which prevents bending of leads or paddle. The plate includes a plurality of leads and a heat sink which are embedded therein, whereby the mounting of the semiconductor package on the printed circuit board is made easier. A semiconductor chip is attached to the heat sink of the plate and a plurality of metal wires electrically connects a plurality of the leads of the plate and the semiconductor chip.
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Arroyo Teresa M.
LG Semicon Co. Ltd.
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