Plate and column type semiconductor package having heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257706, 257707, 257676, H01L 2328, H01L 2310, H01L 2334

Patent

active

058775617

ABSTRACT:
An improved plate and column type semiconductor package has a heat sink embedded in a plate, which prevents bending of leads or paddle. The plate includes a plurality of leads and a heat sink which are embedded therein, whereby the mounting of the semiconductor package on the printed circuit board is made easier. A semiconductor chip is attached to the heat sink of the plate and a plurality of metal wires electrically connects a plurality of the leads of the plate and the semiconductor chip.

REFERENCES:
patent: 3290564 (1966-12-01), Wolff, Jr.
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4420767 (1983-12-01), Hodge et al.
patent: 4975761 (1990-12-01), Chu
patent: 5012386 (1991-04-01), McShane et al.
patent: 5455384 (1995-10-01), Ichihara
patent: 5471011 (1995-11-01), Maslakow
patent: 5490324 (1996-02-01), Newman
patent: 5523622 (1996-06-01), Harada et al.
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5600101 (1997-02-01), Sakai
patent: 5604328 (1997-02-01), Kubota et al.
patent: 5608265 (1997-03-01), Kitano et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plate and column type semiconductor package having heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plate and column type semiconductor package having heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plate and column type semiconductor package having heat sink will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-425568

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.