Integrated circuit prepared by selectively cleaning copper...
Integrated circuit structure and manufacturing method thereof
Integrated circuit structure having contact openings and vias fi
Integrated circuit structure having low dielectric constant...
Integrated circuit structure with thin dielectric between at...
Integrated circuit substrate having embedded wire conductors...
Integrated circuit system with dummy region
Integrated circuit utilizing an air gap to reduce capacitance be
Integrated circuit which uses a damascene process for producing
Integrated circuit which uses a recessed local conductor for pro
Integrated circuit with a titanium nitride contact barrier havin
Integrated circuit with a titanium nitride contact barrier havin
Integrated circuit with active devices under bond pads
Integrated circuit with active regions having varying...
Integrated circuit with an air bridge having a lid
Integrated circuit with at least one bump
Integrated circuit with bonding layer over active circuitry
Integrated circuit with bonding layer over active circuitry
Integrated circuit with conductive lines disposed within...
Integrated circuit with conductive lines disposed within...