Integrated circuit with at least one bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S736000, C257S773000, C257S774000, C257S775000, C257S780000, C257S781000, C257SE23001, C257SE23020

Reexamination Certificate

active

10534330

ABSTRACT:
In an integrated circuit (1) having a substrate (3) and having a signal-processing circuit (4) which is produced at a surface (8) of the substrate (3), there is provided on the substrate surface (8) a protective layer (12) that has at least one aperture (13) through which a second contact pad (14) is electrically and mechanically connected to a first contact pad (9), wherein the second contact pad (14) is of a height of at least 15 μm and projects laterally beyond the aperture (13) on all sides and is seated on the protective layer (12) by an overlap zone (z) that is closed on itself like a ring, wherein the overlap zone (z) has a constant width of overlap (w) of between 2 μm and 15 μm, and wherein at least one element of the signal-processing circuit (4), and preferably only one capacitor (5) of the signal-processing circuit (4), is provided opposite the first contact pad (9).

REFERENCES:
patent: 5719448 (1998-02-01), Ichikawa
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 5821855 (1998-10-01), Lewis
patent: 6313537 (2001-11-01), Lee et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit with at least one bump does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit with at least one bump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit with at least one bump will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3807547

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.