Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2007-07-24
2007-07-24
Bruce, David (Department: 2809)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S736000, C257S773000, C257S774000, C257S775000, C257S780000, C257S781000, C257SE23001, C257SE23020
Reexamination Certificate
active
10534330
ABSTRACT:
In an integrated circuit (1) having a substrate (3) and having a signal-processing circuit (4) which is produced at a surface (8) of the substrate (3), there is provided on the substrate surface (8) a protective layer (12) that has at least one aperture (13) through which a second contact pad (14) is electrically and mechanically connected to a first contact pad (9), wherein the second contact pad (14) is of a height of at least 15 μm and projects laterally beyond the aperture (13) on all sides and is seated on the protective layer (12) by an overlap zone (z) that is closed on itself like a ring, wherein the overlap zone (z) has a constant width of overlap (w) of between 2 μm and 15 μm, and wherein at least one element of the signal-processing circuit (4), and preferably only one capacitor (5) of the signal-processing circuit (4), is provided opposite the first contact pad (9).
REFERENCES:
patent: 5719448 (1998-02-01), Ichikawa
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 5821855 (1998-10-01), Lewis
patent: 6313537 (2001-11-01), Lee et al.
Bruce David
Fortin Kevin H.
NXP B.V.
Tran Tony
LandOfFree
Integrated circuit with at least one bump does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit with at least one bump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit with at least one bump will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3807547