LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead

Selected: C

D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

Copper damascene with low-k capping layer and improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper die bumps with electromigration cap and plated solder

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper diffusion barrier, aluminum wetting layer and improved me

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper diffusion barriers made of diamond-like nanocomposits...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper diffusion deterrent interface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect for an integrated circuit and methods...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect systems

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect systems which use conductive,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect with improved barrier layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnect with top barrier layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnection and the method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnection and the method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnection structure incorporating a metal seed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnections with enhanced electromigration...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interconnects with improved electromigration...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper interposer for reducing warping of integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Copper metal structure for the reduction of intra-metal...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

Charities
Companies
MP Candidates
Patents
Employee Salary Disclosure

World

Places of the World
Scientific Papers

United States

Banks
Companies
Counties
Patents
Employee Salary Disclosure