Copper diffusion barriers made of diamond-like nanocomposits...

Details Copper diffusion barriers made of diamond-like nanocomposits... Copper diffusion barriers made of diamond-like nanocomposits...

2006-03-28

2006-03-28

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000

Reexamination Certificate

active

07019399

ABSTRACT:
The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.

REFERENCES:
patent: 5786068 (1998-07-01), Dorfman et al.
patent: 6015597 (2000-01-01), David
patent: 6300236 (2001-10-01), Harper et al.
Venkatraman, C., et al., “Electrical perperties of diamond-like nanocomposite coatings”, 1997, Thin Solid Films, Elsevier Science, pp. 173-177.
“Lithographic Patterns With a Barrier Liner”, Mar. 1, 1990, IBM Tech. Dis. Bul. (ITDB), vol. 32 No. 10B, pp. 114-115.

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