Copper die bumps with electromigration cap and plated solder

Details Copper die bumps with electromigration cap and plated solder Copper die bumps with electromigration cap and plated solder

2011-04-05

2011-04-05

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S772000, C257SE23021, C257SE23069, C438S613000, C438S614000

Reexamination Certificate

active

07919859

ABSTRACT:
Embodiments of the invention include apparatuses and methods relating to copper die bumps with electtomigration cap and plated solder. In one embodiment, an apparatus comprises an integrated circuit die, a plurality of copper bumps on a surface of the die, electromigration(EM) caps substantially covering a mating surface of the copper bumps capable of controlling intermetallic formation between the cooper bumps and solder, and solder plating on the EM caps capable of protecting the EM caps from oxidation prior to packaging.

REFERENCES:
patent: 4707418 (1987-11-01), Takiar et al.
patent: 4922322 (1990-05-01), Mathew
patent: 5208186 (1993-05-01), Mathew
patent: 6930389 (2005-08-01), Huang
patent: 7087104 (2006-08-01), Choi et al.
patent: 7122460 (2006-10-01), Hua
patent: 7135770 (2006-11-01), Nishiyama et al.
patent: 7223695 (2007-05-01), Zhong et al.
patent: 7276801 (2007-10-01), Dubin et al.
patent: 7391112 (2008-06-01), Li
patent: 7416980 (2008-08-01), Zhong
patent: 2004/0007779 (2004-01-01), Arbuthnot et al.
patent: 2007/0045833 (2007-03-01), Zhong
patent: 2008/0045013 (2008-02-01), Lavoie
patent: 2009/0127710 (2009-05-01), Daubenspeck et al.

Affiliated with

Also associated with

Rating

Copper die bumps with electromigration cap and plated solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper die bumps with electromigration cap and plated solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper die bumps with electromigration cap and plated solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2636639