Sidewalls for guiding the via etch
Signal layer interconnect using tapered traces
Silicon packaging with through wafer interconnects
Silicon wafers containing conductive feedthroughs
Single damascene integration scheme for preventing copper...
Single semiconductor element in a flip chip construction
Single twist layout and method for paired line conductors of int
Slot via filled dual damascene interconnect structure...
Slurry filling a recess formed during semiconductor fabrication
Small geometry contact
Sockets for “springed” semiconductor devices
Solder bump formation in electronics packaging
Specially shaped contact via and integrated circuit therewith
Specially shaped contact via and integrated circuit therewith
Stable metal structure with tungsten plug
Stacked semiconductor package and method for manufacturing...
Stacked via in copper/polyimide BEOL
Static memory with self aligned contacts and split word lines
Static type semiconductor memory device
Stress isolating signal path for integrated circuits