High performance thermally enhanced package and method of...

Details High performance thermally enhanced package and method of... High performance thermally enhanced package and method of...

2007-02-06

2007-02-06

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S712000

Reexamination Certificate

active

10368337

ABSTRACT:
A high performance thermally enhanced package and method of fabricating the same is provided. A chip (a wire bond chip or a flip chip) and a carrier (lead frame or tape carrier) are bonded together using flip-chip technology and thermal compression. The chip and the carrier are encapsulated using a molding compound. The package has a smaller overall size and the capacity to withstand electromagnetic interference.

REFERENCES:
patent: 6469897 (2002-10-01), Ho et al.

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