Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-03-22
2005-03-22
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S786000
Reexamination Certificate
active
06870273
ABSTRACT:
Gridded I/O pads for flip-chip packages in which a coaxial-like solder bump pad configuration is used in which the I/O pads closest to the signal or bump pad are power or ground pads. The ground pads surrounding the signal pad form a coaxial-like pad configuration for impedance matching at the transition from die to package substrate. The ground pads surrounding the signal pad may be connected by a metal trace to form a ground pad ring. The invention employs conductor-backed ground coplanar waveguides (GCPW), which match impedance at connections between I/O cells and signal pads to enhance signal transmission, avoid reflection and leakage, and provide superior electromagnetic shielding. The present invention also supports high quantities of I/Os for a given die size, and supports flexible power and ground placement.
REFERENCES:
patent: 6140710 (2000-10-01), Greenberg
patent: 6215377 (2001-04-01), Douriet
patent: 6232660 (2001-05-01), Kakimoto et al.
patent: 6242814 (2001-06-01), Bassett
patent: 20040026794 (2004-02-01), Tao et al.
P. Petre et al., “Simulation and Performance of Passive Microwave and Millimeter Wave Coplanar Waveguide Circuit Devices with Flip Chip Packaging”, IEEE Electrical Performance of Electronic Packaging, 1997, pp. 203-206.
Daniela Staiculescu, et al., “Design Rule Development for Microwave Flip-Chip Applications,” IEEE Trans. on Microwave Theory and Techniques, vol. 48, No. 9, Sep. 2000, pp. 1476-1481.
Little Vernon R.
Tao Yuming
PMC-Sierra Inc.
Prenty Mark V.
Vermette Clifford W.
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