Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-11-27
2007-11-27
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257SE23021, C257S780000, C257S686000, C257S659000, C310S344000, C310S348000, C333S247000
Reexamination Certificate
active
11212912
ABSTRACT:
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.
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Itoh Toshihiro
Suga Tadatomo
Chu Chris C.
Fujitsu Limited
Kabushiki Kaisha Toshiba
Matsushita Electric - Industrial Co., Ltd.
NEC Corporation
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