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Method of cutting blocks of hard substances into plates by means

Stone working – Sawing – Reciprocating
Patent

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Method of cutting semiconductor ingots and apparatus for cutting

Stone working – Sawing – Reciprocating
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Method of slicing a workpiece through use of a wire saw, and a w

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Method of slicing semiconductor single crystal ingot

Stone working – Sawing – Reciprocating
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Method of slicing silicon wafers for laser marking

Stone working – Sawing – Reciprocating
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Multi-wafer slicing with a fixed abrasive

Stone working – Sawing – Reciprocating
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Multi-wafer slicing with a fixed abrasive

Stone working – Sawing – Reciprocating
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Multi-wire saw

Stone working – Sawing – Reciprocating
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Multi-wire saw device for slicing a semi-conductor ingot into wa

Stone working – Sawing – Reciprocating
Patent

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Multi-wire vibratory cutting method and apparatus

Stone working – Sawing – Reciprocating
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Oscillatory abrasive cable power saw

Stone working – Sawing – Reciprocating
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Percussion sawing machine to saw stone blocks into slabs

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Process and apparatus for multiple lap cutting of solid material

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Process for multiple lap cutting of solid materials

Stone working – Sawing – Reciprocating
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Process for producing heat sink having good heat dissipating cha

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Process for the orientation of several single crystals disposed

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Process of cutting wafers

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Process of forming a plated wirepack with abrasive particles onl

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Reciprocating slurry saw

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Recycling system of wire saw abrasive grain slurry and...

Stone working – Sawing – Reciprocating
Reexamination Certificate

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