Process of cutting wafers

Details Process of cutting wafers Process of cutting wafers

1977-02-11

1978-06-06

Whitehead, Harold D.

Stone working

Sawing

Reciprocating

51263, 51 21, B28D 108

Patent

active

040929728

ABSTRACT:
In a cutting process in which a blade under tension is moved relative to a workpiece, that improvement wherein the blade has a longitudinally-extending abrasive-holding portion defined by blade material that is softer than the workpiece to be cut and overlies a high tensile strength core, the blade is placed under tension adjacent a charging element, and abrasive particles are introduced into the interface between the blade and charging element and partially embedded in the abrasive-holding portion by moving the blade relative to the charging element while forcing the blade and element towards each other.

REFERENCES:
patent: 2073678 (1937-03-01), Broughton
patent: 2369068 (1945-02-01), Mentzer
patent: 2793478 (1957-05-01), Rohowetz
patent: 3540427 (1970-11-01), Anderson

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