Multi-wafer slicing with a fixed abrasive

Stone working – Sawing – Reciprocating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51 65, 83411R, B28D 102

Patent

active

046467106

ABSTRACT:
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.

REFERENCES:
patent: 460049 (1891-09-01), Hill
patent: 1897541 (1933-02-01), Van Berkel
patent: 3066564 (1962-12-01), Carpenter
patent: 3154990 (1964-11-01), Woods
patent: 3239914 (1966-03-01), Shirakura
patent: 3272195 (1966-09-01), Meyer
patent: 4092972 (1978-06-01), Schmid
patent: 4187827 (1980-02-01), Regler
patent: 4187828 (1980-02-01), Schmid

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-wafer slicing with a fixed abrasive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-wafer slicing with a fixed abrasive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-wafer slicing with a fixed abrasive will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1011095

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.