Method of slicing a workpiece through use of a wire saw, and a w

Details Method of slicing a workpiece through use of a wire saw, and a w Method of slicing a workpiece through use of a wire saw, and a w

1998-01-20

2000-05-16

Rose, Robert A.

Stone working

Sawing

Reciprocating

457 21, 457 60, 457446, B28D 106

Patent

active

060622091

ABSTRACT:
There is disclosed a method of slicing a workpiece through use of a wire saw. The workpiece is pressed at a predetermined feed rate against a wire which moves from a wire feed side to a wire take-up side and slices the workpiece into wafers while abrasive grain slurry is fed to the press contact portion between the wire and the workpiece. The feed rate of the workpiece is controlled according to the size of abrasive grains in the abrasive grain slurry, such that a decrease in the slicing stock removal stemming from a decrease in the size of abrasive grains during slicing is compensated with an increase in the slicing stock removal effected by decreasing the feed rate of the workpiece. The method can make the thicknesses of sliced wafers uniform to the extent possible.

REFERENCES:
patent: 3831576 (1974-08-01), Mech
patent: 4441281 (1984-04-01), Gordiski
patent: 5269285 (1993-12-01), Toyama et al.

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