Process for producing heat sink having good heat dissipating cha

Details Process for producing heat sink having good heat dissipating cha Process for producing heat sink having good heat dissipating cha

1994-03-24

1998-08-18

Rose, Robert A.

Stone working

Sawing

Reciprocating

451 57, B28D 106

Patent

active

057946078

ABSTRACT:
A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group comprising a plurality of plane parallel plates or pins that are integral with the bottom plate.

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The Application of Two-Phase Push-Pull Cooling Module in Pin-fin array Electronic Device, Yu-Lin Chao and Fang-Lin Chao, (Eighth Annual IEEE Semi Conductor Thermal Measurement and Management Symposium, Feb. 3-5, 1992) pp. 97-100 Electronics Int'l., 55(17):46-48 (Aug. 1982).

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