Multi-wire saw device for slicing a semi-conductor ingot into wa

Details Multi-wire saw device for slicing a semi-conductor ingot into wa Multi-wire saw device for slicing a semi-conductor ingot into wa

1995-12-14

1998-02-10

Eley, Timothy V.

Stone working

Sawing

Reciprocating

125 21, 125 1, B28D 108

Patent

active

057158061

ABSTRACT:
A multi-wire saw device for slicing a semiconductor ingot and method therefore provides a plurality of spaced wires for cutting the ingot which is held by two sets of clip boards therebetween. The sets of clip boards form a holding means which may ascend and descend in order to engage the cutting wires. The multi wire saw device includes a cassette having chambers partioned by wires extending between opposite cassette ends and into which individual wafers fall. The cassette is formed with teflon resin for easy entry of the wafers.

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IBM Technical Disclosure Bulletin, vol. 16, No. 10, Mar. 1974, New York US, p. 3237 A.S. Shah et al. "Row-Pass Laser Cutting".

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