Method of cutting blocks of hard substances into plates by means

Stone working – Sawing – Reciprocating

Patent

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125 1601, 125 21, 836511, B28D 106

Patent

active

060417668

DESCRIPTION:

BRIEF SUMMARY
FIELD OF TECHNOLOGY

The invention relates to a method of cutting blocks of hard substances into plates, especially blocks consisting of semi-conductors, glass and ceramics, as well as a saw for carrying out this method.


PREVIOUS STATE OF THE ART

For cutting up blocks of hard substances, e.g. blocks made of semi-conductors, ceramics and glass, a method is usually used which uses the effect of an abrasive added in the loose state and a movable solid carrier, generally a continuous wire, on the substance to be cut. This method is characterised in that the abrasive, distributed in a liquid, for example in oil, is conveyed with the aid of a wire via a system of grooved rollers to the cutting point, the cut substance being gradually pressed by a chain of revolving wires. The thickness of the cut plates is determined by the distance between the grooves in the rollers, the thickness of the wire or the granularity of the abrasive, and the quality of the cut is determined by the abrasive material and the block substance as well as by additional technological parameters.
A series of methods and devices are known, e.g. according to patent documents U.S. Pat. No. 4,494,523, U.S. Pat. No. 4,574,769, U.S. Pat. No. 4,640,259, U.S. Pat. No. 4,903,682, U.S. Pat. No. 5,201,305, U.S. Pat. No. 5,269,285 or GB 2 216 441, which describe devices and protect various embodiments of same using the given principle. A common feature of the traditional solutions is that the wire is led in a system of grooved rollers in such a manner that, during the cutting process, it moves in all the cuts of the block in one direction at any given time. The result of this is that the plates produced do not have a constant thickness along the cut, i.e. that they taper in the direction of the movement of the wire as a result of the decreasing effect and amount of wire abrasive adhering to the wire as it passes through the cut in the block. The size of the taper can be partially corrected by moving the wire in both direction, by guiding the moving wire after a certain cutting time, with the aid of reverse switching the movement, in all the block cuts in an opposite direction. However, a disadvantage of this method consists in the fact that the cutting process is noticeably slowed down and the cutting does not proceed continuously since it involves great energy losses when the movement of the wire is stopped and started, the possibility of interference in the cyclically reversed and stressed nodal points of the device increasing.


ESSENCE OF THE INVENTION

The method defined in claim 1 overcomes the disadvantages listed above. Its essence consists in the fact that the continuous solid carrier, which runs in the peripheral grooves in the rollers of a roller system consisting of at least one pair of deflection rollers and one pair of guide rollers, is pressed into the material to be cut such that it is guided in opposite directions in respectively two adjacent cuts in the block. The continuous solid carrier in the chain of the roller system is here guided repeatedly in peripheral grooves from the upper side of the first deflection roller over the upper side of the guide roller lying opposite on to the lower side of the adjacent second deflection roller, after passing which it is guided over the upper side of the guide roller oriented in the opposite direction back to the lower side of the first deflection roller and then back to its upper side.
The saw for cutting tip blocks according to this method consists of a roller system which has rollers provided with peripheral grooves and which is attached to a frame, a table with mountings, a wire guide and an arrangement for transporting and heat-stabilising the abrasive. It is characterised in that the roller system is formed from at least one pair of guide rollers and at least one pair of deflection rollers, the deflection rollers being so mounted in relation to the guide rollers that the guide roller and deflection roller mounted beside one another rotate in opposite directions, the direction of rotation

REFERENCES:
patent: 2831476 (1958-04-01), Wilson et al.
patent: 2911875 (1959-11-01), Ostermann et al.
patent: 3008864 (1961-11-01), Macklem et al.
patent: 3027285 (1962-03-01), Eisner et al.
patent: 3115087 (1963-12-01), Ginaven
patent: 3155087 (1964-11-01), Dreyfus
patent: 3359848 (1967-12-01), Ostermann
patent: 3630114 (1971-12-01), Bunting, Jr. et al.
patent: 3824982 (1974-07-01), Bowman
patent: 3831576 (1974-08-01), Mech
patent: 3841297 (1974-10-01), Mech
patent: 3889699 (1975-06-01), Ranieri
patent: 3942508 (1976-03-01), Shimizu
patent: 3957028 (1976-05-01), Lesiourd et al.
patent: 3976045 (1976-08-01), Coggins, Jr.
patent: 4016856 (1977-04-01), McLaughlin
patent: 4044509 (1977-08-01), Bos et al.
patent: 4092971 (1978-06-01), Viscount
patent: 4092972 (1978-06-01), Schmid
patent: 4105012 (1978-08-01), Hini et al.
patent: 4134384 (1979-01-01), Schafft et al.
patent: 4160439 (1979-07-01), Piat
patent: 4191159 (1980-03-01), Collins
patent: 4287869 (1981-09-01), Schmid
patent: 4384564 (1983-05-01), Smith et al.
patent: 4576139 (1986-03-01), Cogswell
patent: 4580545 (1986-04-01), Dorsten
patent: 4655191 (1987-04-01), Wells et al.
patent: 4674474 (1987-06-01), Baril
patent: 4694715 (1987-09-01), Jongerius
patent: 4735188 (1988-04-01), Kubo
patent: 4765307 (1988-08-01), Kubo
patent: 4766875 (1988-08-01), Feigelson
patent: 4776316 (1988-10-01), Ashkenazi
patent: 4787363 (1988-11-01), Kubo
patent: 4832411 (1989-05-01), Johnston et al.
patent: 4893607 (1990-01-01), Kubo
patent: 4907564 (1990-03-01), Sowa et al.
patent: 4967725 (1990-11-01), Hinzen
patent: 5052366 (1991-10-01), Matsukura
patent: 5060628 (1991-10-01), Ishida
patent: 5074277 (1991-12-01), Milholen
patent: 5099820 (1992-03-01), Stricot
patent: 5193518 (1993-03-01), Moller et al.
patent: 5269285 (1993-12-01), Toyama et al.
patent: 5377568 (1995-01-01), Hauser
patent: 5377659 (1995-01-01), Tank et al.
patent: 5383443 (1995-01-01), Buyens
patent: 5519938 (1996-05-01), Kojima et al.
patent: 5564409 (1996-10-01), Bonzo et al.
patent: 5575189 (1996-11-01), Kiuchi et al.
patent: 5605141 (1997-02-01), Bilotta
patent: 5609148 (1997-03-01), Mitwalsky et al.
patent: 5628301 (1997-05-01), Katamachi
patent: 5699782 (1997-12-01), Toyama
patent: 5711287 (1998-01-01), Speer
patent: 5715806 (1998-02-01), Tonegawa et al.
patent: 5715807 (1998-02-01), Toyama et al.
patent: 5771876 (1998-06-01), Egglhuber
patent: 5794607 (1998-08-01), Aihara et al.
patent: 5829424 (1998-11-01), Hauser
patent: 5865162 (1999-02-01), Kambe et al.

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