Method of cutting semiconductor ingots and apparatus for cutting

Details Method of cutting semiconductor ingots and apparatus for cutting Method of cutting semiconductor ingots and apparatus for cutting

1997-07-31

1999-03-02

Morgan, Eileen P.

Stone working

Sawing

Reciprocating

125 21, B28D 108

Patent

active

058757708

ABSTRACT:
The present invention proposes a method for cutting semiconductor ingots into sliced wafers by use of wire saws, so that the cut-out surface shape of wafers can be easily controlled by utilizing a wire-saw cutting device.
The workpiece holding plate 21 is disposed in such a way that it can move along the longitudinal axis Y of the semiconductor ingot 3. The semiconductor ingot 3 is moved downward to facilitate the cutting operation by wire saw. Accordingly, the displacement along the longitudinal axis Y is made to change in response to the variation along the location of the semiconductor ingot 3.

REFERENCES:
patent: 5616065 (1997-04-01), Egglhuber
patent: 5628301 (1997-05-01), Katamachi
patent: 5699782 (1997-12-01), Toyama
patent: 5715806 (1998-02-01), Tonegawa et al.
patent: 5715807 (1998-02-01), Toyama et al.

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