Micro-electro-mechanical device and manufacturing method for...
Microelectronic assemblies with multiple leads
Microelectronic assemblies with multiple leads
Microelectronic device wafers and methods of manufacturing
Micromachined self packaged circuits for high-frequency applicat
Micromachined structures including glass vias with internal...
Micromechanical strained semiconductor by wafer bonding
Microwave bonding of MEMS component
MOSFET device with a strained channel
Multifunctional metallic bonding
Multifunctional metallic bonding
Multilayer structure with controlled internal stresses and...
Multilayered semiconductor wafer and process for...
Multiple substrate electrical circuit device