Micromachined self packaged circuits for high-frequency applicat

Details Micromachined self packaged circuits for high-frequency applicat Micromachined self packaged circuits for high-frequency applicat

1996-12-05

1999-06-15

Chaudhuri, Olik

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

438 51, 438125, 438692, 257275, 257684, 257728, 333246, 333247, H01L 2120, H01L 2160, H01L 2980, H01P 308

Patent

active

059131349

ABSTRACT:
A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.

REFERENCES:
patent: 4550296 (1985-10-01), Ehrlinger et al.
patent: 5311153 (1994-05-01), Lau et al.
"Micromachined Conformal Package for Microwave and Millimeter-Wave Application"' IEEE MTT-S Digest, pp. 1387-1390, 1995.
Walid Y. Ali-Ahmad, William L. Bishop, Thomas W. Crowe, and Gabriel M. Rebeiz; A 250 GHz Planar Low Noise Schottky Receiver; International Journal of Infrared and Millimeter Waves; vol. 4, 1993, pp. 737-749.
Walid Y. Ali-Ahmad, et al.; A Submillimeter-Wave Planar Low Noise Schottky Receiver; 1993, IEEE MTT-S Digest, pp. 527-530.
Walid Y. Ali-Ahmad, et al.; An 86-106 GHz Quasi-Integrated Low Noise Schottky Receiver, IEEE, Transactions on Microwave Theory and Techniques, vol. 41, No. 4, Apr. 1993, pp. 37-39.
Walid Y. Ali-Ahmad, Gabriel M. Rebeiz; A 335 GHz Quasi-Optical Schottky Receiver; IEEE Microwave and Guided Wave Letters; vol. 4, No. 2, Feb. 1994, pp. 37-39.
George Vassos Eleftheriades; Analysis and Design of Integrated-Circuit Horn Antennas for Millimeter and Submillimeter-Wave Applications; Dissertation, University of Michigan 1993.
Walid Youssef Ali-Ahmad; Millimeter and Submillimeter-Wave Integrated Horn Antenna Schottky Receivers; Dissertation, University of Michigan 1993.
Bryzek, Petersen, and McCulley; Micromachines on the March; IEEE Spectrum, May 1994, pp. 20-31.
Eugene D. Jungbluth; Waveguide and Detector Integrated on Silicon; May 1994, Laser Fucus World, pp. 38-40.
Nikkei Weekly; Micromachine Manufacturing Gets Boost; Science & Technology May 9, 1994.
David Maliniak; Technology Advances; Electronic Design, Jun. 13, 1994.
Tewksbury and Hornak; Can Optoelectronic and Silicon Chips be Monolithically Integrated?; Laser Focus World, May 1994, pp. 151-156.
Markus Yap, Yu-Chong Tai, William R. McGrath, Christopher Walker, Silicon Micromachined Waveguides for Millimeter and Submillimeter Wavelengths; Third International Symposium on Space Terahertz Technology, pp. 316-323.
Katehi, Rebiez, Weller, Drayton, Cheng, Whitaker; Micromachined Circuits for Millimeter-and-Sub-Millimeter-Wave Applications; IEEE Antennas and Propagation Magazine, vol. 35, No. 5, Oct. 1993, pp. 9-17.
Drayton, Katehi; Micromachined Circuits for Mm-Wave Applications; presented at the 23rd. European Microwave Conference--1993, pp. 1-6.
Drayton, and Katehi; Development of Miniature Microwave Circuit Components Using Micromachining Techniques; 1994 IEEE MTT-S International Microwave Symposium--1993, pp. 1-8.
Linda P.B. Katehi; Novel Transmission Lines for the Submillimeter-Wave Region; Proceedings of the IEEE vol. 80, No. 11, Nov. 1992, pp. 1771-1787.
Dib, Harokopus Jr., Katehi, Ling, and Rebeiz; Study of a Novel Planar Transmission Line; 1991 IEEE MTT-S Digest, pp. 623-626.
J. Auzins and R.V. Wilhelm; Automative Electronics; IEEE Potentials, pp. 32-36, adapted and reprinted from IEEE Circuits & Devices, vol. 10, No. 1, Jan. 1994.

Affiliated with

Also associated with

Rating

Micromachined self packaged circuits for high-frequency applicat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromachined self packaged circuits for high-frequency applicat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachined self packaged circuits for high-frequency applicat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-409961