Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
Reexamination Certificate
2010-07-23
2011-11-15
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Having enclosed cavity
C438S051000, C257SE21002
Reexamination Certificate
active
08058145
ABSTRACT:
It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
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Izumi Konami
Tateishi Fuminori
Yamaguchi Mayumi
Fan Michele
Fish & Richardson P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Smith Matthew
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